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Jobs in Fab 10N/X
90 roles in Fab 10N/X posted in the last 30 days, newest first, with 406 live in total. Every link opens the employer's own posting.
Every one of these 406 roles is at Micron Technology.
10posted in 7 days
90posted in 30 days
406live roles
1employers
Micron Technology300
- Night Shift TEM Technician
- SG PD Photolithography Process Development Engineer
- Security Specialist – Physical Security Technology
- Physical Security Specialist
- Construction Ultra Pure Water & Waste Water Treatment Staff / Senior Engineer
- SR ENGINEER - F10 FAC CONTROL
- Construction Gas Staff Engineer / Senior Engineer
- Construction ELV Staff / Senior Engineer
- Construction Electrical Staff / Senior Engineer
- Construction Mechanical Staff/Senior engineer
- Principal/Staff Process Integration Engineer, NAND Technology Integration
- Intern - Planning Strategic Layout
- F10 Probe Manufacturing Technician
- Intern - Chemical Laboratory and Document Management
- Intern - PEE CVD
- STPG Product Engineering Industrial Engineer
- Construction Chemical Senior Engineer / Staff Engineer
- Facilities Engineer (Electrical/Mechanical/Control Systems)
- Intern - F10 MFG Implant (Bench)
- Engineer / Senior Engineer - NAND Reliability STPG PE
- Intern - ATE PTO
- Automated Materials Handling System (AMHS) Technician
- Intern - Chemical Mechanical Planarization Process Engineering
- PROBE Equipment Technician
- Senior Engineer – Process Development, Thin Films (CVD/Diffusion) NAND
- STAFF ENGINEER - CVD ADV. NAND PD
- SR ENGINEER CVD ADV. NAND PD
- Sr Engineer, Process Development, Cell Film , Advance NAND
- Principal Engineer, PD SG Thin Film (CVD/Diffusion)
- Staff Engineer ,CVD ADV. NAND PD
- Staff Engineer, CVD ADV. NAND PD
- Principal Engineer, PD Adv NAND Cell Film
- Sr Engineer, PD Adv NAND Cell Film
- SENIOR ENGINEER - PCVD PROCESS DEV
- Staff Engineer, PD Adv NAND Photolithography
- Senior Engineer, Adv PD Photolithography
- Staff Engineer, PD Adv NAND Photolithography
- Staff Engineer, PD Adv NAND Dry Etch
- Principal Engineer , CMP Advanced NAND
- Staff Engineer - CMP Advanced NAND
- Staff Engineer - CMP Advanced NAND
- Senior Engineer, PD Adv CMP
- Senior Engineer, PD Adv CMP
- ENGINEER/SENIOR ENGINEER - NAND PRODUCT DEVELOPMENT ENGINEER
- Principal Engineer – PD Adv Dry Etch
- Staff Engineer – PD Adv Wet Process
- Staff Engineer – PD Adv Wet Process
- Senior Engineer, PD Adv NAND Dry Etch
- SENIOR/ENGINEER - PCVD PROCESS DEV
- Intern - HVM PEE Photo (AI)
- Technologist - Incoming Quality Control
- Engineer - QEM CC
- Intern - NAND Probe Product Engineering (Test Mode Integration)
- Intern - NAND Process and Equipment Engineer
- SHIFT ENGINEER LEAD, NAND TD RDA and Metrology
- Director, Facilities Construction
- GLOBAL EHS SENIOR CONSTRUCTION PROGRAM MANAGER
- F10 MFG Equipment Technician
- Sr Engineer, NAND PI
- SHIFT ENGINEER, TD MFG DEV ENGG
- Engineer, NAND NTI RDA Shift Operations
- Engineer, NAND NTI RDA Shift Operations
- Intern- PIE RAM (Agentic AI)
- Staff Engineer, STPG PE NAND
- Senior Engineer, NTI Yield Analysis
- Intern - F10 HVM Photo PEE
- Senior Eng/Engineer, Global Front End Planning SG Satellite Scenario and Capital
- Fab 10 DAST Production Control Technologist
- F10 Robotics & Automation Technician
- Senior Engineer, Process Integration, NAND NTI
- Intern - NAND Wafer Reliability
- Engineer - QEM Incoming Quality Control
- Principal/Staff ML/AI Engineer, Product Engineering, STPG
- TECHNICIAN - F10 MANUFACTURING PRODUCTION
- Intern - STPG PE NAND Reliability
- Engineer, Global Facilities Standardization
- PRINCIPAL ENGINEER, NAND PI
- MTS, NAND PI
- SMTS, NAND PI
- DMTS, NAND PI
- Principal/Staff Engineer, Process Integration, NTI NAND
- TECHNICIAN - FACILITIES OPERATIONS
- Fab10 FAC Member of Technical Staff (MTS) - Electrical
- Senior/Staff Engineer, NTI Metrology
- Intern- F10 Manufacturing Engineer
- Sr. Engineer, NAND Cell Integration
- Process & Equipment Engineer
- Engineer, Yield Enhancement
- Engineer, New Product Introduction
- Staff STPG NAND Product Development Engineer
- Engineer - STPG PE NAND
- Principal NAND Reliability Product Engineer
- Staff/Principal Engineer - CMP Advanced NAND
- SMTS/DMTS – NAND Process Pathfinding – Wet Etch
- Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND
- Principal/Staff Engineer, PCVD Film Deposition, TD
- Member of Technical Staff (MTS) – 3D NAND Process Integration
- STAFF/PRINCIPAL ENGINEER - CMP PROCESS DEV
- Staff/Principal Engineer, NAND TD, RDA
- Principal Engineer – 3D NAND Process Integration
- Intern - PEE CVD/PVD
- Intern - MFG PHOTO
- Intern - F10 PEE WET
- Intern - ADTS ATI PI
- Intern - PIE YE
- Intern, Photo Manufacturing Data Analytics and AI
- Intern - Probe Automation
- Intern - Test Solutions, NVM
- F10 Planning Site Inventory Control (SIC) Engineer
- New Product Introduction (NPI) Planning Engineer
- ENGINEER - PLANNING IE
- ENGINEER - PLN Operation Intelligence
- ENGINEER - Planning (Layout)
- Engineer - Planning (Materials and Spares Planning)
- ENGINEER - Planning (Operations Modelling)
- NTI Physical Failure Analysis Technician
- Intern, Facilities AI Engineering
- Intern - F10 Process Integration Analytics
- Intern - F10 Process and Equipment Engineer
- Intern, Probe Process Control
- Intern- Environmental, Health & Safety (EHS)
- Intern - PIE PI (Product Integration Engineering, Process Integration)
- Engineer - QEM QDM
- Intern - F10 PHOTO PEE
- Engineer - QEM PQE YIELD
- Intern - F10 Process and Equipment Engineer
- Intern - MFG WET
- Intern - F10 ADTS ATE Dry Etch
- Intern- NAND Probe Product Engineering
- Intern - F10 Process & Equipment Engineer
- Intern - NAND Device Engineering AI
- Intern - Manufacturing Equipment Engineer
- Intern - Facilities Mechanical Engineering
- INDIRECT REGIONAL SUPPLIER MANAGER
- Engineer, Yield Enhancement Laboratory
- Engineer, Yield Enhancement Laboratory
- Intern - RDA (Real-Time Defect Analysis)
- Intern - F10 Process and Equipment Engineer
- Intern - NAND Product Development Engineer
- Intern - PLN (Planning) Strategic Layout
- Intern - QEM Contamination Control (CC) (Polytechnic Students)
- Manufacturing Equipment/Production Engineer
- Engineer - NAND Cell Reliability
- Sr Engineer, Process Development, Cell Film , Advance NAND
- TECHNOLOGIST – QEM PCS
- Senior / Principal Engineer, NAND Product Engineering
- Distinguished Member of Technical Staff (DMTS) – Process Development, Cell Film, NAND
- Distinguished Member of Technical Staff (DMTS) – Process Development, Photolithography, NAND
- Senior Member of Technical Staff (SMTS) – Process Development, Cell Film, NAND
- Member of Technical Staff (MTS) – Process Development, Photolithography, NAND
- Member of Technical Staff (MTS) – Process Development, Cell Film, NAND
- Principal Engineer – Process Development, Cell Film, NAND
- Principal Engineer – Process Development, Photolithography, NAND
- Staff Engineer – Process Development, Cell Film, NAND
- Senior Engineer – Process Development, Photolithography, NAND
- Senior Member of Technical Staff (SMTS) – Process Development, Photolithography, NAND
- Staff Engineer – Process Development, Photolithography, NAND
- Distinguished Member of Technical Staff (DMTS) – Process Development, Dry Etch, NAND
- Senior Member of Technical Staff (SMTS) – Process Development, Dry Etch, NAND
- Distinguished Member of Technical Staff (DMTS) – Process Development, Thin Films (CVD/Diffusion), NAND
- Member of Technical Staff (MTS) – Process Development, Dry Etch, NAND
- Principal Engineer – Process Development, Dry Etch, NAND
- Member of Technical Staff (MTS) – Process Development, Thin Films (CVD/Diffusion), NAND
- Staff Engineer – Process Development, Dry Etch, NAND
- Senior Engineer – Process Development, Dry Etch NAND
- Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND
- Senior Engineer – Process Development, Thin Films (CVD/Diffusion) NAND
- Distinguished Member of Technical Staff (DMTS) – Process Development, Wet, NAND
- Senior Member of Technical Staff (SMTS) – Process Development, Thin Films (CVD/Diffusion), NAND
- Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND
- Member of Technical Staff (MTS) – Process Development, WET, NAND
- Principal Engineer – Process Development, Wet, NAND
- Staff Engineer – Process Development, Wet, NAND
- JR100843 Staff Engineer – Process Development, Wet, NAND
- Staff Engineer, NAND TD, RDA
- Sr Engineer, SPMO Construction
- Senior Member of Technical Staff (SMTS) – Process Development, CMP, NAND
- Distinguished Member of Technical Staff (DMTS) – Process Development, CMP, NAND
- ENGINEER, FAC BUILDING SERVICES
- ENGINEER, FAC BUILDING SERVICES
- Senior Engineer – Process Development, Wet, NAND
- NTI Process Integration Technician
- NTI Process Integration Technician
- NTI Process Integration Technical Specialist
- NTI Process Integration Technical Specialist
- Senior Manager - Process Development CMP/BTG, NAND
- TECHNOLOGIST - CHEMLAB
- Product Development Team Lead
- Staff / Principal Recruiter – Talent Acquisition (Singapore)
- Technologist - PEE Fab Support
- Senior Manager, F10 Construction
- Staff/ Principal Engineer, CMOS Process Integration, NTI
- Senior Engineer, PD SG, Dry Etch, NAND
- E5_MTS_SMTS NAND Design Rule Engineer in Process Integration
- GLOBAL FE PLANNING MODELING SNR/ENGINEER
- Fab10 Facilities Construction Document and Cost Control Engineer
- SNR/STAFF SHIFT ENGINEER LEAD, TD MFG DEV ENGG
- SHIFT ENGINEER, TD MFG DEV ENGG
- Engineer - QEM PQE Electrical Failure Analysis
- Senior Engineer, Process Development, Wet, NTI
- Senior/Engineer, NAND Wafer Level Reliability & Design
- STAFF ENGINEER/PRINCIPAL ENGINEER - PD SG WET PROCESS
- Global EHSS Principal Electrical Safety Engineer
- Contamination Control Technologist
- ENGINEER, QEM PQE QUALITY
- Senior/Principal NAND Device Engineer
- Staff/ Principal Engineer STPG Product Engineering - Probe
- Senior/Staff Engineer STPG Product Engineering - Probe
- Senior/Staff STPG Product Engineering - Probe
- Engineer/Sr. Eng/Prinicipal Eng - NAND CMOS Device
- Technician - DAST WH
- Engineer, Shift Manufacturing
- ENGINEER - PLN STRATEGIC LAYOUT
- SNR ENGINEER, PD SG PHOTO
- SNR ENGINEER - FAC ELECTRICAL
- Manufacturing Equipment/Production Engineer
- ENGINEER - PROBE SHIFT EQUIPMENT
- Probe Manufacturing Shift Engineer
- ENGINEER, F10 DAST AUTOMATION
- ENGINEER - PROBE SOFTWARE & ANALYTICAL
- F10 PROBE AUTOMATION ENGINEER
- PROBE AREA ENGINEER
- Engineer, Metrology & Real Time Defects Analysis
- ENGINEER - QEM CHEMLAB
- Engineer - Change Management
- Engineer - QEM Process Control System(PCS)
- Engineer - QEM PRODUCT QUALITY ENGINEERING (PQE)
- Engineer - QEM PRODUCT QUALITY ENGINEERING YIELD
- Engineer - QEM PQE Electrical Failure Analysis
- Engineer, Yield Enhancement
- Technologist - MFG WET
- ENGINEER - PD SG CMP
- Member of Technical Staff (MTS) – 3D NAND Process Integration
- Principal Engineer / MTS – NAND Process Pathfinding - Thin Films
- SMTS / DMTS – NAND Process Pathfinding - Thin Films & Materials
- Principal Engineer / MTS – NAND Process Pathfinding – Dry Etch
- Principal Engineer – NAND Process Pathfinding – Dry Etch
- SR ENGINEER, FAC MECHANICAL
- Lead Staff Engineer / Lead Principal Engineer PD SG Diffusion/Implant
- Senior/Principal Engineer, Process Integration, NAND, NTI
- Senior/Principal Engineer, Process Integration, NAND, NTI
- Engineer, Strategic Planning - Capital & Reuse
- Test Engineer
- SR. ENGINEER - PD SG regE
- Staff/Principal Engineer, NAND Product Engineering
- Engineer, NAND Product Engineering
- Senior Engineer, NAND Product Engineering
- Engineer - PLN Ops Modelling
- SNR ENGINEER, PD SG CMP
- ENGINEER, QEM PCS SPC/R2R
- Night Shift TEM Engineer
- Senior Eng/Engineer, Global Front End Planning SG Satellite Scenario and Capital
- Engineer – 3D NAND Process Integration
- Principal Engineer, Electrical & Control Engineering
- Senior Engineer - NAND Cell Reliability
- Senior Engineer - Electrical Failure Analysis, NTI
- Engineer - QEM Product Quality Engineering (Wafer Level Reliability)
- Staff Engineer, Leadership Development, Learning & Transformation
- Sr Engineer, Building Services Construction Electrical
- Engineer - QEM Contamination Control (Environment/Process)
- Process & Equipment Engineer Fab Support
- NAND Cell Device Engineer
- Environment Health Safety Engineer - Safety
- Engineer, Yield Enhancement
- Engineer, Process Integration
- Engineer, Real Time Defect Analysis
- Engineer, Metrology & Real Time Defects Analysis
- Intern - ADTS PEE Dry Etch
- Engineer, Facilities Tool Install
- FACILITIES ENGINEER - ELECTRICAL
- FACILITIES ENGINEER - CONTROL
- Engineer, Strategic Program Management Office, Workforce Development
- ENGINEER, F10 SPM PMO
- FACILITIES ENGINEER - BUILDING SERVICES
- FAC ENGINEER - UPW & WWTP
- ENGINEER - F10 FAC MECHANICAL
- ENGINEER - FACILITIES OPERATION
- SHIFT ENGINEER, TD MFG DEV ENGG
- SHIFT ENGINEER, TD MFG DEV ENGG
- SHIFT ENGINEER, TD MFG DEV ENGG
- Equipment Technician
- Manufacturing Technician
- Metrology & Real-Time Defect Analysis Technician
- Facilities Technician
- Quality Technician
- Intern- Process and Equipment Engineer (Photo)
- Engineer, Metrology
- Engineer, Process and Equipment Engineering
- Intern - Process & Equipment Engineering
- Advanced NAND Process Integration Group Lead
- Engineer - QEM Incoming Quality Control
- Engineer - QEM Incoming Quality Control
- Engineer, Yield Enhancement
- Engineer, Process Integration
- Engineer, Real Time Defect Analysis
- Process & Equipment Engineer
- Intern - NAND Product Engineering - Probe AI/ML
- Senior Engineer, Process Integration, Advanced NAND
- Senior/Staff Engineer, Process Integration, NTI NAND
- Manager, Electrical, Facilities Engineering